MGS Resin BPR20 + Curing agent BPH20 (0.486 Kg) 12/BOX

MGS BP20 is a solvent-free epoxy-based bonding paste designed for fast-setting applications in composite structures. It is ideal for bonding composites and metals, delivering excellent mechanical properties and high thermal resistance. With easy-to-use cartridges and reliable performance, it suits demanding industrial and operational environments.

Application

• Fast setting bondings and repairs on composite structures, bonding of composites and met

Mixing and Preparation

• Mixing Ratio: 100:45 ± 2 parts by weight or 100:50 ± 2 parts by volume

Application Techniques

Cartridge Application

• MGS BP20 is supplied in pre-measured cartridges for easy mixing and application.
• Remove the cap nut and plug, and ensure resin and hardener levels are even.
• Attach the static mixer and secure it with the cap nut.
• Dispense 5–15 grams to achieve a uniform color, ensuring proper mixing.
• Apply the bonding paste directly to the prepared surface.

Processing Temperature

• Recommended Processing Temperature Range: 15°C to 30°C

Curing Process

• Initial Curing: Achieves good mechanical properties after 24 hours at room temperature (RT)
• Curing Agent Compatibility: Compatible with BPH20
• Post-Curing:Full properties achieved with 3 hours at 60°C (140°F)

Sizes

MGS BP20 is available in:

• Cartridges: Standard 400ml SBS (side-by-side) cartridges or 195ml single cartridges.
• Small Drums: For larger-scale applications requiring manual mixing.

Data Sheets

• Technical Data Sheet
• Safety Data Sheet